OpenAI is reportedly working with Broadcom to develop new {custom} silicon designed to deal with its massive AI workloads for inference and secured manufacturing capability with TSMC, based on sources speaking to Reuters. OpenAI has reportedly constructed a chip growth crew of about 20 individuals, together with lead engineers who beforehand labored on Google’s Tensor processors for AI.
Nonetheless, on its present timeline, the custom-designed {hardware} might not begin manufacturing till 2026.
The Info had reported in July that OpenAI was in discussion with Broadcom and different semiconductor designers about creating its personal AI chip, and earlier this 12 months, Bloomberg reported that OpenAI was working to build its personal community of foundries, however based on Reuters, these plans have been placed on ice as a result of value and time.
The reported technique places OpenAI on the same monitor to the opposite tech firms making an attempt to handle prices and entry to AI server {hardware} with {custom} chip designs. However Google, Microsoft, and Amazon are all already a couple of generations down the road of their efforts, and OpenAI may have considerably extra funding to develop into a real competitor.
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